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d a t a sh eet preliminary speci?cation file under integrated circuits, ic02 march 1991 integrated circuits TDA4566 colour transient improvement circuit
march 1991 2 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 general description the TDA4566 is a monolithic integrated circuit for colour-transient improvement (cti) and luminance delay line in gyrator technique in colour television receivers. features colour transient improvement for colour difference signals (r-y) and (b-y) with transient detecting-, storage- and switching stages resulting in high transients of colour difference output signals a luminance signal path (y) which substitutes the conventional y-delay coil with an integrated y-delay line switchable delay time from 550 ns to 820 ns in steps of 90 ns and additional fine adjustment of 37 ns two y output signals; one of 180 ns less delay quick reference data note 1. delay time is proportional to resistor r 14-18 . r 14-18 also influences the bandwidth; a value of 1.2 k w results in a bandwidth of 5 mhz (typ.). package outline 18-lead dil; plastic (sot102); sot102-1; 1996 november 27. parameter conditions symbol min. typ. max. unit supply voltage (pin 10) v p 10.8 12 13.2 v supply current (pin 10) i p - 35 50 ma y-signal delay at pin 12 s1 open; r 14-18 = 1.2 k w ; note 1 v 15-18 = 0 to 2.5 v t 17-12 490 550 610 ns v 15-18 = 3.5 to 5.5 v t 17-12 580 640 700 ns v 15-18 = 6.5 to 8.5 v t 17-12 670 730 790 ns v 15-18 = 9.5 to12 v t 17-12 760 820 880 ns y-signal ampli?cation 0.5 mhz a y 012db (r-y) and (b-y) signal attenuation a cd - 10 + 1db output transient time t tr - 100 200 ns
march 1991 3 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 fig.1 block diagram.
march 1991 4 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 fig.2 internal pin circuit diagram.
march 1991 5 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 ratings limiting values in accordance with the absolute maximum system (iec 134) thermal resistance note 1. pins 3, 4, 5, 6, 9, 13 and 14 dc potential not published. parameter symbol min. max. unit supply voltage range (pin 10) v p =v 10-18 0 13.2 v voltage ranges to pin 18 (ground) at pins 1, 2, 12 and 15 v n-18 0v p v at pin 11 v 11-18 0(v p - 3 v) v at pin 17 v 17-18 07v voltage ranges at pin 7 to pin 6 v 7-6 05v at pin 8 to pin 9 v 8-9 05v currents at pins 6, 9 i 6, 9 - 10 + 10 ma at pins 7, 8, 11 and 12 i 7, 8, 11, 12 internally limited total power dissipation (t j = 150 c; t amb =70 cp tot - 1.1 w storage temperature range t stg - 25 + 150 c operating ambient temperature range t amb 0 + 70 c from junction to ambient (in free air) r th j - a = 70 k/w
march 1991 6 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 characteristics v p =v 10-18 = 12 v; t amb =25 c; measured in application circuit fig.3; unless otherwise speci?ed parameter conditions symbol min. typ. max. unit supply (pin 10) supply voltage v p 10.8 12 13.2 v supply current i p - 35 50 ma colour difference paths (r-y) input voltage (75% colour bar signal) (peak-to-peak value) v 1(p-p) - 0.63 1.5 v (b-y) input voltage (75% colour bar signal) (peak-to-peak value) v 2(p-p) - 0.8 1.9 v input resistance (r-y) r 1-18 81216 k w (b-y) r 2-18 81216 k w internal bias voltage (r-y) v 1-18 3.8 4.3 4.8 v (b-y) v 1-18 3.8 4.3 4.8 v signal attenuation (r-y) v 8 / v 1 - 10 + 1db (b-y) v 7 / v 2 - 10 + 1db output transient time note 1 t tr - 100 200 ns output resistance (b-y) r 7-18 - 100 -w (r-y) r 8-18 - 100 -w dc output voltage (b-y) v 7-18 3.8 4.3 4.8 v (r-y) v 8-18 3.8 4.3 4.8 v output current note 2 source i 7, 8 0.4 -- ma sink - i 7, 8 1.0 -- ma
march 1991 7 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 y-signal path y-input voltage (composite signal) capacitive (peak-to-peak value) coupling v 17(p-p) - 0.45 0.62 v internal bias voltage during clamping v 17-18 2.1 2.4 2.7 v input current during picture content i 17 - 812 m a during sync. pulse - i 17 - 100 150 m a y-signal delay at pin 12 s1 open; r 14 = 1.2 k w ; notes 3 and 4 at v 15 - 18 = 0 to 2.5 v t 17-18 490 550 610 ns at v 15-18 = 3.5 to 5.5 v t 17-18 580 640 700 ns at v 15 - 18 = 6.5 to 8.5 v t 17-18 670 730 790 ns at v 15-18 = 9.5 to12 v t 17-18 760 820 880 ns fine adjustment of y-signal delay for all 4 steps s1 closed t 17-12 - 37 - ns signal delay between pin 11 and pin 12 s1 open t 11-12 160 180 200 ns dependency of delay time on temperature - 0.001 - k - 1 on supply voltage -- 0.03 - v - 1 input switching current - i 15 - 15 25 m a y-signal attenuation f = 0.5 mhz pin 11 from pin 17 v 11 /v 17 - 10 + 1db pin 12 from pin 17 v 12 /v 17 0 + 1 + 2db frequency response at 3 mhz referred to 0.5 mhz note 5 pin 11 0 - 3.0 db pin 12 0 - 3.0 db parameter conditions symbol min. typ. max. unit t 17 12 C d t 17 12 C t j d ------------------------------ t 17 12 C d t 17 12 C v d ----------------------------- p v 11 (3 mhz) v 11 (0.5 mhz) ------------------------------------- v 12 (3 mhz) v 12 (0.5 mhz) -------------------------------------
march 1991 8 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 notes 1. output signal transient time measured with c 6-18 =c 9-18 = 220 pf without resistor (see fig. 3). 2. output current measured with emitter follower with constant current source of 0.6 ma. 3. r 14-18 influences the bandwidth; a value of 1.2 k w results in a bandwidth of 5 mhz (typ.). 4. delay time is proportional to resistor r 14-18 . devices with suffix a require the value of the resistor to be 1.15 k w; a 27 k w ; resistor connected in parallel with r 14-18 = 1.2 k w .; 5. frequency response measured with v 15-18 = 9.5 v and switch s1 open. frequency response at 5 mhz referred to 0.5 mhz note 5 pin 11 - 3.0 - 2.0 db pin 12 - 3.0 - 2.0 db dc output voltage pin 11 v 11-18 1.8 2.3 2.6 v pin 12 v 12-18 9.8 10.3 10.8 v output current note 2 source i 11, 12 -- 0.4 ma sink - i 11, 12 -- 1.0 ma parameter conditions symbol min. typ. max. unit v 11 (5 mhz) v 11 (0.5 mhz) ------------------------------------- v 12 (5 mhz) v 12 (0.5 mhz) -------------------------------------
march 1991 9 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 application information table 1 switching sequence for delay times. notes 1. when switch (s1) is closed the delay time is increased by 37 ns. 2. where: x = connection closed; 0 = connection open. connection (2) voltage at pin 15 delay time (ns) (1) (a) (b) (c) 0 0 0 0 to 2.5 v 550 0 0 x 3.5 to 5.5 v 640 0 x x 6.5 to 8.5 v 730 x x x 9.5 to 12 v 820 fig.3 application diagram and test circuit. (1) residual carrier reduced to 20 mv peak-to-peak (r = 1 k w , c = 100 pf). (2) switching sequence for delay times shown in table 1. (3) r 14 - 18 = 1.2 k w for TDA4566. r 14 - 18 = 1.15 k w for TDA4566a (27 k w resistor connected in parallel to 1.2 k w ).
march 1991 10 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 package outline references outline version european projection issue date iec jedec eiaj sot102-1 93-10-14 95-01-23 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.254 2.54 7.62 8.25 7.80 9.5 8.3 0.85 4.7 0.51 3.7 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.01 0.10 0.30 0.32 0.31 0.37 0.33 0.033 0.19 0.020 0.15 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 18 1 10 9 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. dip18: plastic dual in-line package; 18 leads (300 mil) sot102-1
march 1991 11 philips semiconductors preliminary speci?cation colour transient improvement circuit TDA4566 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). soldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. repairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.

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